產品線
MULTIX ++并行架構提供的性能。 MULTIX ++系統是優化檢測速度的理想選擇,可以并行驅動多達256個通道。 可直接使用其專用軟件或通過第三方應用程序遠程使用。 可以使用設置軟件處理復雜的配置。
處理技術
標準相控陣
MultiX ++系統可以執行電子和/或扇形掃查,全矩陣捕獲(FMC),脈沖回波,采用標準UT,TOFD,線性,矩陣,TRL,個性化2D ...相控陣探頭進行間距捕獲采集,最多可包含256個晶片
表面自適應超聲波 (SAUL)
表面自適應超聲波 (SAUL) 技術專為復雜復合材料結構的檢測而設計,可使用的配置檢測具有不同幾何形狀(平面,凹面,凸面)的元件。 SAUL是飛機制造商及其供應商使用的理想工具,用于檢測復雜的復合材料部件。
SAMRT
智能柔性探頭是由CEA和IMASONIC共同設計的相控陣探頭(線性或矩陣),具有適形的前面和實時輪廓。 SMART是M2M處理這些探頭的軟件插件。當探頭沿著復雜的部件移動時,SMART能夠實時保持超聲波束的特性。
快速模式
快速模式本身包含在MultiX ++系統中,可優化多個孔徑的并行點火(在相同或不同的探頭上)。 它旨在提高生產率,同時保持與電子掃查所達到的相同分辨率。
此外,當接收陣列的整個光圈與電子掃描相結合時,快速模式甚至可以實現更快的速度。 此過程僅需單詞發射的時間。 非常適合檢測厚元件又要求速度的情況。
此外,當接收陣列的整個光圈與電子掃描相結合時,快速模式甚至可以實現更快的速度。 此過程僅需單詞發射的時間。 非常適合檢測厚元件又要求速度的情況。
SPECIFICATIONS
acquisition | |
Hardware acquisition gates, software gates, synchronization of gates Acquisition trigger on event (threshold, echo, etc.), acquisition on user-specified trigger (e.g., time, coder) | Choice of data (e.g., RF, peaks, elementary A-Scan), real-time imaging, user-specified configuration Public file format for parameters (XML) and data (binary), max. data flow 30 MB/s |
phased-array | |
Customized focusing, electronic scanning, sectorial scanning, full matrix capture (FMC) Pulse-echo and transmit-receive modes, DDF with dynamic aperture | 2GB hardware RAM (enabling fast multiplexing), Corrected images (e.g., sectorial B-Scan, C-Scan) |
pulsers | |
Adjustable voltage: 30 to 200V with 1V step Negative rectangular pulse Adjustable width: 30 ns to 625 ns, step of 2.5 ns | Rise time < 10 ns (200V, 50 ?) Max. PRF: 30 KHz |
receivers | |
Bandwidth: 0.8 to 20MHz Adjustable gain on each channel from 0 to 80 dB Cross-talk between two channels > 50 dB | Max. input signal amplitude: 0.8 Vpp Adjustable analog DAC on 80 dB (max. 40 dB/µs) synchronized on events |
digitizer | |
Digitizing and real-time summation on 32-channel boards Max. sampling frequency: 100 MHz (adjustable from 100 MHz to 6.6 MHz) Global delay: 0 up to 1.6 ms, step of 10 ns Delay-laws at transmission/reception: 0 to 20 µs, step of 2.5 ns | Range: 16 bits FIR filters Input impedance: 50 ? Digitizing depth: up to 50,000 samples (16,000 samples max. per elementary channel) |
hardware / firmware configuration | |
Parallel summations for fast data acquisition / beam forming Parallel architecture: 32-, 64-, 128-, and 256-channel systems are available | FPGA on CPU-board Windows-based PC, USB2 link between Hardware and PC (desktop or laptop) |
software | |
CIVA subset into Multi2000 software, complete description of the inspection configuration | Focal-laws and associated ultrasonic field computation |
Compatibility with CIVA, NDT kit / ULTIS |
I-O | |
32: 1 Hypertronix connector 64,128: 2 Hypertronix connectors 256: 4 Hypertronix | |
8 encoders input, 31 analog input + 1 synchro output 2 switch, 4 TTL inputs, 4 TTL outputs | 8 analog outputs, 2 open collector, 1 I/O synchro,1 USB2 16 analog inputs, 4 LEMO connectors (type 00) (up to 8 optional) |
General | |
32, 64, 128: L x W x H: 236 mm x 376 mm x 266 mm Weight: ~9.5 kg | 256: L x W x H: 342 mm x 376 mm x 266 mm Weight: ~13 kg |
Indicated values may change without notice.